

KingMax, a Taiwan-based manufacturer of RAM/memory card modules, has introduced its Hercules DDR3 2200, a DRAM module that makes use of the nano thermal dissipation technology. This technology dissipates heat without using a heatsink which makes possible the Hercules DDR3 2200’s slim and lightweight design.
Tests conducted by KingMax revealed that the thermal radiation mode of the nano thermal dissipation technology is superior to that of an ordinary heatsink which uses a medium to dissipate heat. As indicated in the test report, the nano thermal dissipation technology can effectively improve thermal performance by 9.5% and that the Hercules DDR3 2200 DRAM module exhibits high thermal performance during overclocking operations.
KingMax’s Hercules DDR3 2200 MHz dual-channel DRAM module has a high-speed transmission bandwidth that enables it to reach 17.6 GB/sec and allows gamers to enjoy overclocking without unduly raising the temperature that might cause the system to crash. Without a heatsink, it is not only lighter and slimmer, it also creates a larger free space within the computer case to improve air circulation and stabilize system operations. In addition, by getting rid of the heatsink, KingMax has likewise reduced product cost.

































